Figure 5 Surface roughness Selleckchem Ipatasertib by AFM. (a) 2D and (b) 3D AFM images of the smooth surface, and (c) 2D and (d) 3D AFM images

of the self-assembled nanotip W BE surface. Figure 6 Cumulative probability of HRS/LRS. Cumulative probability of 4 × 4, 20 × 20, and 50 × 50 μm2 cross-point resistive switching Quizartinib manufacturer memory devices. Figure 7 Data retention and endurance. (a) Good data retention and (b) excellent ac endurance with every cycle reading of >105 are obtained. All switching devices have such a long endurance. Conclusions Improvement in the resistive switching and self-compliance behaviors of a forming-free resistive memory stack of Ir/TaO x /W in a cross-point structure has been obtained. The cross-sectional TEM image confirms the amorphous TaO x /WO x film. The AFM image shows the presence GW786034 ic50 of nanotips on the W bottom electrode surface. The device has shown excellent switching uniformity during 100 consecutive dc sweeps with set/reset voltages of ±2.5 V and a resistance ratio of >100. The self-compliance behavior which comes from the bulk resistance of the stack shows the built-in capability of the device

to minimize current overshoot during switching. The improvement in the switching is attributed to the formation of a defective switching layer and bottom electrode surface morphology with nanoscale tips which can enhance the electric field resulting in Tenofovir the uniform formation/rupture

of the oxygen vacancy conducting filament. The device has exhibited an ac cycle endurance of >105 cycles and a data retention of >104 s. It is expected that this self-compliance, low-voltage-operated cross-point resistive memory device could be useful for the development of future nanoscale nonvolatile memory devices. Acknowledgements This work was supported by the National Science Council (NSC), Taiwan, under contract number NSC-102-2221-E-182-057-MY2. References 1. Waser R, Aono M: Nanoionics-based resistive switching memories. Nat Mater 2007, 6:833.CrossRef 2. Lee MJ, Lee CB, Lee D, Lee SR, Chang M, Hur JH, Kim YB, Kim CJ, Seo DH, Seo S, Chung UI, Yoo IK, Kim K: A fast, high-endurance and scalable non-volatile memory device made from asymmetric Ta 2 O 5− x /TaO 2− x bilayer structures. Nat Mater 2011, 10:625.CrossRef 3. Liu Q, Sun J, Lv H, Long S, Yin K, Wan N, Li Y, Sun L, Liu M: Real-time observation on dynamic growth/dissolution of conductive filaments in oxide-electrolyte-based ReRAM. Adv Mater 1844, 2012:24. 4. Park J, Lee W, Choe M, Jung S, Son M, Kim S, Park S, Shin J, Lee D, Siddik M, Woo J, Choi G, Cha E, Lee T, Hwang H: Quantized conductive filament formed by limited Cu source in sub-5 nm era. In Proceedings of the 2011 IEEE International Electron Devices Meeting (IEDM): Dec 5–7 2011; Washington, DC. Piscataway: IEEE; 2011:63. 5.