formation of the wire grid with closed loops is compl


formation of the wire grid with closed loops is completed by the constriction of this perforated film into thin wires with anchor points on the unaffected film pads on the substrate. Depending on the specific selleck irradiation pattern and the resulting positions of film rupture, nodes of the wires in between these anchor points above the substrate level are formed. In contrast to the so-called laser dynamic forming (LDF) [12], the shape of the resulting structure is not determined by the shape of a mold, but only by the beam pattern and the material parameters of film and confinement layer. However, in some cases, LDF utilizes a polymer encapsulation of the film to be formed to minimize degradation of the VX-765 price functional film in a similar way to the polymer confinement of this work [13]. Conclusion Silica wire grids with micron- to sub-micron-size periods and nanometer wire diameter are made by patterned laser irradiation of silicon suboxide

films on quartz substrates with polymer top confinement. The specific grid pattern can be varied by tuning fluence and irradiation pattern. The process is based on pulsed laser-induced local softening, forming, and resolidification under AZD6244 chemical structure control of the confinement layer. Various applications in the fields of optics, micro- and nanofluidics, or medical technology (adhesion of cells) are imaginable. References 1. Delmdahl R, Fechner B: Large-area microprocessing with

excimer lasers. Appl Phys A 2010, 101:283–286.CrossRef 2. Henley SJ, Carey JD, Silva SRP: Pulsed-laser-induced nanoscale island formation in thin metal-on-oxide films. Phys Rev B 2005,72(195408):1–10. 3. Wehner M, Hessling M, Ihlemann J: Ablative micro-fabrication. find more In Excimer Laser Technology. Edited by: Basting D, Marowsky G. Berlin: Springer; 2005:149–200.CrossRef 4. Piqué A: Laser transfer techniques for digital microfabrication. In Laser Precision Microfabrication. Edited by: Sugioka K, Meunier M, Piqué A. Berlin: Springer; 2010:259–291.CrossRef 5. Brown MS, Kattamis NT, Arnold CB: Time-resolved study of polyimide absorption layers for blister-actuated laser-induced forward transfer. J Appl Phys 2010,107(083103):1–8. 6. Schulz-Ruhtenberg M, Ihlemann J, Heber J: Laser patterning of SiO x -layers for the fabrication of diffractive phase elements for deep UV applications. Appl Surf Sci 2005, 248:190–195.CrossRef 7. Klein-Wiele J-H, Simon P: Sub-100 nm pattern generation by direct writing using a confinement layer. Opt Expr 2013, 21:9017–9023.CrossRef 8. Ihlemann J, Weichenhain-Schriever R: Laser based rapid fabrication of SiO 2 -phase masks for efficient UV-laser micromachining. J Laser Micro/Nanoeng 2009, 4:100–103.CrossRef 9. Jahn M, Richter J, Weichenhain-Schriever R, Meinertz J, Ihlemann J: Ablation of silicon suboxide thin layers. Appl Phys A 2010, 101:533–538.CrossRef 10.

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